SYSTEM FOR COOLING OF ELECTRONIC COMPONENTS

Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An effi cient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer fi nning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40–50^oC.
Results of computational and experimental investigations of heat pipes having a predetermined thermal resistance and a system based on these pipes for air cooling of electronic components and diode assemblies of lasers are presented. An effi cient compact cooling system comprising heat pipes with an evaporator having a capillary coating of a caked copper powder and a condenser having a developed outer fi nning, has been deviced. This system makes it possible to remove, to the ambient air, a heat flow of power more than 300 W at a temperature of 40–50^oC.
Author:  L. L. Vasil′ev Jr., L. P. Grakovich, L. A. Dragun, UDC 536.24 A. S. Zhuravlev, V. A. Olekhnovich, and M. I. Rabetskii
Keywords:  heat pipe, evaporator, condenser, cooling, electronic components
Page:  95