DEVELOPMENT OF THE REGIMES OF SEMIAUTOMATIC CONTACT SOLDERING

The infl uence of the soldering rod length on the contact soldering temperature has been studied. The results of investigations were taken as a basis for incorporating a high-speed semiautomatic regime of soldering integrated circuits with planar leads to multilayer printed circuit boards. It has been established that to ensure an optimum soldering temperature it is necessary to take account of the temperature of the soldering rod before soldering, its length and diameter, and the soldering time when the rod is short
   
Author:  V. N. Shtennikov
Keywords:  contact soldering, multilayer printed circuit board, temperature, heat exchange, solder
Page:  282